Home About Us Analytical Techniques Problem Solving Analysis Consultancy Industrial Sectors Contact Us
Main Index
Microelectronics Wafer Surface Cleanliness and Wetting
Main Index
SEM/EDX Particle Analysis
Materials Analysis
Chemical Analysis
Physical Structural and Microstructural Analysis
Typical Technical Expertise

Contact Us
Print this page

Holder for filmsIn microelectronics manufacturing of silicon wafers adequate wetting of chemicals used in deposition or removal processes is vital to generate high die yields per wafer.


The cleanliness of silicon of coated wafers can be assessed by the consistency of the contact angle over a mapped surface. This is mirrored in the success with which consecutive layers of electronic devices are laid down, during the capacitor manufacturing process.


The surface of the substrate in terms of its polar / non-polar nature and chemistry can be evaluated and quantified by XPS to determine why areas of the wafer are generating the poor wetting characteristics measured by the contact angles to determine the root cause. Wetting can be the result of contaminant layers less than a few nm thick, perhaps left from inadequate or ineffective upstream removal processes or poor cleaning and rinsing steps for example.
 

Copyright 2019 LPD Lab Services Ltd. All rights reserved.